Dry-pack (MBB, desiccant, HIC)for India’s semiconductor packaging lines

Many packaged chips absorb moisture from the air, which can crack or delaminate them when they are heated during soldering. Dry-pack keeps them safe: parts are sealed in a moisture barrier bag with desiccant and a humidity indicator card, following the handling practice set out in IPC/JEDEC J-STD-033.

Illustration of dry-pack materials: a moisture barrier bag, desiccant pack and humidity indicator card

What it does

Why dry-pack matters on the line

  • Moisture barrier bags (MBB) limit how much water vapour reaches the parts inside.
  • Desiccant absorbs the moisture that is sealed into the bag.
  • Humidity indicator cards (HIC) show at a glance whether the parts stayed dry, before they go to the line.

Specifying it

What to define before you buy

  1. 01Bag dimensions, and whether the bag also needs static-shielding properties
  2. 02The moisture sensitivity level (MSL) of the devices being packed
  3. 03Desiccant quantity and format for your bag size
  4. 04Humidity indicator card spot levels your handling procedure calls for
  5. 05Whether bags are vacuum-sealed or heat-sealed on your line

Getting a quote

Tell us what you need

Meridian works as an agency and distributor for established manufacturers. Share these details and we will come back with the right options. We usually reply within one working day.

  • Bag size and quantity
  • MSL of the parts
  • Desiccant and HIC requirements
  • Monthly volume
Send an enquiry

Other packaging materials we supply

Illustration of a carrier tape reel with packaged chips in the tape pockets

Carrier tape & reels

Precision pocketed carrier tape and matching reels for protected automated component handling.

Illustration of a semiconductor wafer mounted on dicing tape in a film frame

Wafer & dicing tapes

Wafer-mount and dicing tapes for secure handling through cutting and downstream processing.