Carrier tape & reels
Precision pocketed carrier tape and matching reels for protected automated component handling.
Wafer & dicing tapesfor India’s semiconductor packaging lines
Before a wafer can be cut into individual chips, it is mounted on dicing tape stretched across a film frame. The tape holds every die firmly in place while the saw cuts through the wafer, then releases them cleanly when they are picked for assembly.
What it does
Why wafer & dicing tape matters on the line
- Holds the wafer and every cut die in position through dicing.
- Releases dies cleanly at pick-up; UV-curable tapes lose most of their tack after UV exposure, which helps with small or thin dies.
- Related tapes protect the circuit side of the wafer while it is thinned by back-grinding.
Specifying it
What to define before you buy
- 01Wafer diameter and thickness
- 02UV-curable or non-UV tape
- 03Adhesion level, matched to your die size and pick-up process
- 04Tape thickness and roll width for your frame and mounter
- 05Whether you also need back-grinding tape
Getting a quote
Tell us what you need
Meridian works as an agency and distributor for established manufacturers. Share these details and we will come back with the right options. We usually reply within one working day.
- Wafer size and thickness
- Die size
- UV or non-UV preference
- Monthly wafer starts
Other packaging materials we supply
Dry-pack (MBB, desiccant, HIC)
Moisture-barrier bags, desiccants and humidity indicator cards for controlled dry packaging.
Copper & PCC bonding wire
Copper and palladium-coated copper wire for semiconductor die-to-package interconnection.